Welcome one, welcome all!

Intel Trip 2023

We are a collective of ambitious Engineering students competing in liquid nitrogen overclocking competitions and developing custom solutions for thermal management, power draw, hardware, software, and ease of use.

Currently we are the only college in the U.S. to have a dedicated overclocking team. We have operated for 7 years, building knowledge and techniques over that time.

With a team of over 25 students we have a variety of disciplines of engineers ranging from mechanical to electronic engineering and everything in between.

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We are currently developing tools such as a controllable heated LN2 Pot, custom LN2 pots with integrated Leidenfrost reducing plates, and a custom lightweight OS. Along with that we are building show stopper pieces such as a passively cooled immersion pc cased and custom 3d printed cases.

We currently have 25+ members actively engaging in overclocking and these projects to build their skills both for competition and for the job market. This is with an experimentalist mindset where we actively test and improve with data we have collected.

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Recent Posts

image from G.Skill Comp Prep Work

G.Skill Comp Prep Work

The big event for there year is upon us! Thanks to our partners we are setup to a shot at qualifying for the top 9 in this years G.Skill World Cup. We are attempting to qualify 3 to 4 members on separate hardware. These members will be competing on Intel’s latest 13th and 14th gen processors paired with ASUS Z790 Apex Encore board’s we are setup to give those competing a serious run for their money.
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image from Leidenfrost Pot Dev Update

Leidenfrost Pot Dev Update

Our Leidenfrost pot team is nearing completion on the first stage of development of our own custom pot design to accept Leidenfrost reducing plates to help improve the heat transfer from the copper heatsink/pot to the LN2 by facilitating a reduction in the Leidenfrost effect. Images of the iterations of pot design and the current machined copper block: The Leidenfrost effect is the when a fluid encounters a hotplate, and the rapid boiling of the liquid creates a gas vapor layer between the liquid and the hot plate.
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image from Immersion Case Dev Update

Immersion Case Dev Update

We are almost done with final dry fitting with all panels now machined out, all that’s left is adding the pass through for power, USB type-c connection, and display out. We have already ordered a 12v power supply to run 3 cables into the case to do power delivery to the CPU and GPU and to connect with a pico power supply for the 24-pin motherboard power delivery. we have achieved the goal originally set out to be under a 2 liter volume to save on the 2 phase dielectric fluid that we are using.
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Overclock Till You Drop

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